ASM International NV

ASM International NV (NASDAQ:ASMI) Pulsar is Industry Leading Process Module for Depositing High-K Gate Dielectrics

ASM International NV (NASDAQ:ASMI) BILTHOVEN, The Netherlands - June 23, 2008 - ASM International N.V. (NASDAQ: ASMI and Euronext Exchange in Amsterdam: ASM). ASMI has agreed with its shareholders Fursa and Hermes to postpone the extraordinary meeting of shareholders (EGM) to be held at the latest on 15 July 2008 pursuant to the ruling issued by the Enterprise Court on 20 May 2008. The EGM was to be held for the purpose of voting on resolutions proposed by Hermes and Fursa with respect to the composition of the Management Board and the Supervisory Board of ASMI following the decision of the Enterprise Court to disallow voting on these resolutions at the annual meeting of shareholders held on 21 May 2008. The EGM will be postponed until 15 October 2008 to enable ASMI to explore and consider its position and options following the unsolicited offer made by Applied Materials Inc. and Francisco Partners to acquire all of ASMI's front-end activities as announced on 17 June.

ASM International NV (NASDAQ:ASMI) BILTHOVEN, The Netherlands - June 20, 2008 - ASM International N.V. (NASDAQ: ASMI and Euronext Exchange in Amsterdam: ASM). On June 17 ASMI received a combined, unsolicited indicative offer from Applied Materials and Francisco Partners for all of its Front-End activities. The offer consists of an offer from Applied Materials for its Atomic Layer Deposition (ALD) and Plasma Enhanced Chemical Vapor Deposition (PECVD) activities with an initial value indication in the range of USD 400 million to USD 500 million and an offer from Francisco Partners for the remainder of its Front-End activities, including its Epitaxy and Vertical Furnaces activities, with an initial value indication in the range of USD 225 million to USD 300 million.

ASM International NV (NASDAQ:ASMI) BILTHOVEN, The Netherlands - June 17, 2008 - ASM International N.V. (NASDAQ: ASMI and Euronext Exchange in Amsterdam: ASM). ASM International (ASMI) announces that it has received a combined, unsolicited indicative offer from Applied Materials, Inc. and Francisco Partners to acquire all front-end business activities. In this combined indicative, non-binding offer, Applied Materials reaffirms its indicative offer as previously announced on 6 June 2008 in respect of the Atomic Layer Deposition (ALD) and Plasma Enhanced Chemical Vapor Deposition (PECVD) activities, whereas Francisco Partners' indicative offer relates to the remaining front-end activities, including epitaxy and vertical furnaces.

ASM International NV (NASDAQ:ASMI) BILTHOVEN, The Netherlands - June 12, 2008 - ASM International N.V. (NASDAQ: ASMI and Euronext Exchange in Amsterdam: ASM). ASM International (ASMI) announced on 6 June 2008 that it had received an unsolicited indicative offer from Applied Materials, Inc. for its ALD (Atomic Layer Deposition) and PECVD (Plasma Enhanced Chemical Vapour Deposition) activities.

ASM International NV (NASDAQ:ASMI) BILTHOVEN, The Netherlands - June 6, 2008 - ASM International (ASMI) announces that it has received an unsolicited indicative offer from Applied Materials, Inc. for its ALD (Atomic Layer Deposition) and PECVD (Plasma Enhanced Chemical Vapour Deposition) activities. For the purpose of this offer, which was communicated orally, Applied Materials has indicated an initial value of these activities in the range of USD 400 million to USD 500 million.

ASM International NV (NASDAQ:ASMI) BILTHOVEN, The Netherlands - June 2, 2008 - ASM International N.V. (NASDAQ: ASMI and Euronext Exchange in Amsterdam: ASM) will host an interconnect technology seminar addressing the integration of extreme low-k materials and ALD metals, on Tuesday, June 3, 2008 at the Hyatt Regency San Francisco Airport Hotel in Burlingame, CA. The seminar, which will feature guest speakers from leading semiconductor industry research consortia, is being held in conjunction with the IEEE International Interconnect Technology Conference (IITC). The presentations will include: "Recent Ru Thin Film Technologies for Cu Interconnect", presented by Dr. Shinichi Ogawa, chief researcher at Selete; and, "Material Aspects of Low-k Integration", addressed by Mikhail Baklanov, principal scientist AMPS Division at IMEC. To conclude the program, ASMI will host a Poster Session addressing advanced interconnect technologies such as UV ...